• J. Micromech. Microeng. 19 (2008) 015027 - [Journal of Microelectromechani]

    2008-12-11

    Analysis, simulation and fabrication of MEMS springs for a micro-tensile system

    Rui Liu, Hong Wang, Xueping Li, Jun Tang, Shengping Mao and Guifu Ding
    Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
    E-mail:     wanghongsjtu@yahoo.com.cn

    Abstract. The support spring of a uniaxial micro-tensile system for testing micro-scale thin films is studied in this paper. Stresses of different shape springs are analyzed with the finite element method (FEM). The simulated results show that the stress of an S-shaped spring is lower compared with a U-shaped spring with the same dimensions (100 µm thick, 100 µm wide, 250 µm inner diameter and 5 turns). The maximum stress of the S-shaped spring is about 133 MPa when the displacement of 100 µm is imposed at one end of the spring along the lateral side. The number of turns has the most important effect on stress and stiffness of the S-shaped spring. Moreover, main stress concentration is symmetric in the spring system and it is located in the arc near to the two fixed ends in all springs. The spindle-shape support spring is fabricated by UV-LIGA technology according to analyzed results and calibrated by the specific device.

    Print publication: Issue 1 (January 2009)
    Received 21 September 2008, in final form 2 November 2008
    Published 10 December 2008
    Tag：Ding_GF
    Steven 发表于09:00:43 | 阅读全文 | 评论 0 | 编辑 | 分享 0

  • J. Micromech. Microeng. 18 (2008) 065002 - [Journal of Micromechanics and]

    2008-04-25

    A micro-tensile method for measuring mechanical properties of MEMS materials

    Rui Liu, Hong Wang, Xueping Li, Guifu Ding and Chunsheng Yang

    Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China

    Abstract. Mechanical properties of micro-electro-mechanical systems (MEMS) materials are increasingly important with the wide use of miniaturized systems. This paper proposes a new method for measuring mechanical properties of thin films. This method is suitable for thin films with large strain (>5%) and can be applied to samples with different thicknesses. The S-shaped support springs of the test chip are able to improve the measurement accuracy. Specimens of Ni thin film, with a gauge section 50 µm wide, 100 µm long and 5 µm thick, were tested. The measured Young's modulus of Ni thin film is about 32 GPa and the tensile strength is about 750 MPa.

    Print publication: Issue 6 (June 2008)
    Received 10 November 2007, in final form 1 April 2008
    Published 25 April 2008

    Tag：Ding_GF Yang_CS
    Steven 发表于19:58:25 | 阅读全文 | 评论 0 | 编辑 | 分享 0
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