• J. Micromech. Microeng. 18 (2008) 117001 - [Journal of Micromechanics and]

    2008-10-10

    An argument for proof testing brittle microsystems in high-reliability applications

    B L Boyce1,4, R Ballarini2 and I Chasiotis3
    1 Materials Science and Engineering Center, Sandia National Laboratories, PO Box 5800, MS0889, Albuquerque, NM 87185-0889, USA
    2 Department of Civil Engineering, University of Minnesota, Minneapolis, MN 55455, USA
    3 Department of Aerospace Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
    4 Author to whom any correspondence should be addressed (tel. no. (505) 845-7525)
    E-mail:     blboyce@sandia.gov

    Abstract. The vast majority of microelectromechanical systems (MEMS) for sensor and actuator applications are fabricated from brittle materials, such as Si, SiC and diamond. Numerous prior studies have shown that the structural reliability of these flaw-intolerant materials is governed by processing-induced critical defects, and that their failure strengths have a wide dispersion associated with a low Weibull modulus. This broad distribution of critical failure conditions creates an uncertainty that cannot be tolerated in high-risk or high-consequence applications. This note presents arguments for the adoption of proof testing methodologies which will provide a statistically-sound basis for certifying MEMS component reliability.

    Print publication: Issue 11 (November 2008)
    Received 12 June 2008, in final form 11 September 2008
    Published 10 October 2008

    Tag：Chasiotis_I Boyce_BL
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